Publications
Conferences
“The Boiling-Driven Heat Spreader Embedded Device for Thermal Management in High-Power Semiconductor”
- Author
- Hyunmuk Lim, Su-Yoon Doh, Seung M. You, Jungho Lee
- Conference
- International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK
- Year
- 2022