Publications
Journals
“Boiling-driven heat spreader for thermal management of high-power chips in liquid cooling applications”
- Journal
- Applied Thermal Engineering
- Author
- Su-Yoon Doh, Seung M. You, Seongmook Jeong, Jungho Lee*
- Year
- 2026
- Link
- https://doi.org/10.1016/j.applthermaleng.2026.129715