Publications
Journals
“Effect of integrated copper pad on the performance of boiling-driven wickless thermal ground plane”
- Journal
- Applied Thermal Engineering
- Author
- Moon J.H., Wang X., Fadda D., Shin D.H., Lee J., You S.M.
- Year
- 2021
- Link
- https://doi.org/10.1016/j.applthermaleng.2021.117595