ATM Lab
Liquid immersion cooling device for data centers
Jungho Lee, 10-2024-0047498, Republic of Korea, 2024-04-08
Apparatus for heat pipe inside coating
Jungho Lee, Rakyeong Yang, 10-2024-0026191, Republic of Korea, 2024-02-23
Heat-pipe type heat exchanger
Jungho Lee, Rakyeong Yang, Sukkyung Kang, Su-Yoon Doh, 22 877 346.1, European Patent Office (EPO), 2023-04-07
Cooling device for reactor core melt
Jungho Lee, 10-2022-0163495, Republic of Korea, 2022-11-29
Injection volume control device for working fluid in heat pipe
Jungho Lee, Kyuil Kim, Sukkyung Kang, 10-2022-0160595, Republic of Korea, 2022-11-25
Heat pipe sealing cover and heat pipe sealing method using the same
Jungho Lee, Rakyeong Yang, Sukkyung Kang, 10-2022-0160594, Republic of Korea, 2022-11-25
Sandblasting nozzle for grinding
Jungho Lee, JinHyeuk Seo, Sukkyung Kang, 10-2022-0160593, Republic of Korea, 2022-11-25
Manufacturing method for heat pipe
Jungho Lee, Sukkyung Kang, Su-Yoon Doh, PCT/KR2022/017312, PCT, 2022-11-07
Jungho Lee, Sukkyung Kang, Su-Yoon Doh, PCT/KR2022/017309, PCT, 2022-11-07
Jungho Lee, Sukkyung Kang, Su-Yoon Doh, 10-2021-0174763, Republic of Korea, 2021-12-08
Jungho Lee, Sukkyung Kang, Su-Yoon Doh, 10-2021-0174762, Republic of Korea, 2021-12-08