Boiling-driven heat spreader for thermal management of high-power chips in liquid cooling applications

Journal

Applied Thermal Engineering

Author

Su-Yoon Doh, Seung M. You, Seongmook Jeong, Jungho Lee*

Year

2026

Link

https://doi.org/10.1016/j.applthermaleng.2026.129715 121회 연결