• 1994.03 ~ 1999.02 : Pohang University of Science and Technology (POSTECH), Ph.D.
• 1992.03 ~ 1994.02 : Pohang University of Science and Technology (POSTECH), MS
• 1988.03 ~ 1992.02 : Pusan National University, BS

• 2021.03 ~ Present : Department of Mechanical Engineering, Ajou University (Professor)
• 2006.08 ~ 2021.02 : Korea Institute of Machinery and Materials (KIMM) (Principal Researcher)
• 2017.05 ~ 2018.05 : Paris Agreement Research and Development Center, Korea Institute of Machinery and Materials (KIMM) (Director)
• 2012.09 ~ 2014.03 : Department of Research Strategy, Korea Institute of Machinery and Materials (KIMM) (Head)
• 2012.06 ~ 2012.08 : University of Oxford (Visiting Scholar)
• 2011.09 ~ 2018.02 : Department of Plant System and Machinery, University of Science and Technology (UST) (Professor)
• 2004.08 ~ 2006.07 : Pohang Iron & Steel Company (POSCO) (Senior Researcher)
• 2002.06 ~ 2004.07 : Samsung Corning Precision Glass (Senior Researcher)
• 1999.08 ~ 2002.04 : Department of Mechanical Engineering, University of Maryland at College Park, MD, USA (Postdoctoral Researcher)
• 1999.03 ~ 1999.07 : Advanced Fluids Engineering Research Center, POSTECH (Postdoctoral Researcher)
  
  
• Executive Board Member, Asian Union of Thermal Science and Engineering (AUTSE) (2020.05~Current)
• Secretary General, Asian Union of Thermal Science and Engineering (AUTSE) (2023.10~Current)
  
• Fellow, Asian Union of Thermal Science and Engineering (AUTSE) (2025.05~Current)
• Scientific Council Member, International Centre for Heat and Mass Transfer (ICHMT) (2023.01~Current)
• President, Korean Society of Fluid Machinery (KSFM), Korea (2026.01~2026.12)
• President, Electronics Equipment Cooling and Thermal Management Division, Korean Society of Fluid Machinery (KSFM), Korea (2023.01~2024.12)
• President, Thermal Engineering Division (TED), Korean Society of Mechanical Engineers (KSME), Korea (2024.01~2024.12)
• Lifetime Member of KSME and KSFM
• Member of ASME, ASM, SPE, ISIJ, and IEEE 

[Major R&D Areas]

• Advanced Thermal Management: High-Power Electronic Equipment, Power Semiconductor, Electric Vehicle (EV) Battery, ESS Battery, Laser-Diode, Data Center Cooling
• Thermal Management Technology for Defense: TGP-embedded Heat Sink, Liquid/Hybrid Cooling, Phase-change Cooling 
• Heat Pipe Heat Exchanger (HPHX) for recovering waste heat
• Wrap-around heat pipe heat exchanger for air conditioning
• Phase-change Heat Transfer (Boiling and Condensation)
• Forced Convection Heat Transfer Enhancement (Jet and Spray)
• Direct liquid cooling for high-density data centers

[Commercial Product Technology Development]

• Heat Pipe, Vapor Chamber, and Thermal Ground Plane (TGP)
• Heat Pipe Heat Exchanger (HPHX)
• Eco-Friendly Ultra Intensive Quenching
• Cooling Devices for Hot Steel Product…

• Heat Transfer
• Applied Heat Transfer
• Phase-Change Heat Transfer
• Experimental Thermal and Fluid Engineering
• Advanced Thermal Management